{"product_id":"9789401790376","title":"Electrical Design of Through Silicon Via","description":"\u003cp\u003eThrough Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003ePublication Year: \u003c\/strong\u003e2014\u003cbr\u003e\u003cstrong\u003eImprint: \u003c\/strong\u003eSpringer Netherlands\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003eFormat: H\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003eWeight (Gram): 606\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e\u003c\/strong\u003e\u003c\/p\u003e","brand":"Manho Lee","offers":[{"title":"Default Title","offer_id":41269474001074,"sku":"9789401790376","price":218.39,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0502\/5382\/4178\/products\/940179037X.01_SCLZZZZZZZ.jpg?v=1636069563","url":"https:\/\/readabook.store\/products\/9789401790376","provider":"READABOOK BY ALKEM","version":"1.0","type":"link"}