Design And Modeling For 3d Ics And Interposers

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Format: Hardcover
No of Pages: 380
Imprint: World Scientific
Publication date: 20131107
Series: Wspc Series In Advanced Integration And Packaging