Embedded Dielectrics For Electronic Packaging

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

Format: Hardcover
No of Pages: 300
Imprint: World Scientific
Publication date: 20211231
Series: Wspc Series In Advanced Integration And Packaging